Ultraviolet laser processing has many advantages, and it is also the preferred technology in the development of scientific and technological information. First of all, ultraviolet lasers can output ultra-short wavelength lasers, which can accurately process ultra-small and fine materials. Secondly, the "cold treatment" of the ultraviolet laser will not destroy the material itself as a whole, but only treat its surface; Moreover, there is basically no thermal damage effect; Some materials cannot be processed due to the inability to effectively absorb visible light and infrared lasers, and the biggest advantage of ultraviolet light is that basically all materials have a wide range of ultraviolet light absorption. Ultraviolet lasers, especially solid-state ultraviolet lasers, are compact and small, simple and easy to maintain, and easy to produce in large quantities.
Ultraviolet lasers are widely used in the processing of medical biomaterials, forensics in criminal cases, integrated circuit boards, semiconductor industry, low-light components, surgery, communication and radar, and laser processing.
Alter the surface properties of biomaterials
In some treatments, many medical materials need to be compatible with human tissues, or even repaired, such as ultraviolet laser treatment of intraocular diseases and rabbit cornea experiments, sometimes it is also necessary to change the biological protein properties and biological macromolecular structure, adjust the optimal pulse parameters of the excimer ultraviolet laser, and irradiate the surface of medical biomaterials with lasers, so as to improve the physical and chemical structure of the surface of the material, and not change the overall chemical structure of the material. The compatibility and hydrophilicity of the treated organic biomaterials with human tissues are significantly improved, which is of great help in medical biological applications.
Forensic field
In the field of forensics, fingerprints can be used as important biometric evidence for criminal suspects to remain at the crime scene when fingerprints are found to have the same unique properties as DNA. Older methods resulted in damage to samples and made it difficult to collect and store evidence.
Nowadays, non-permeable surface fingerprints of objects, such as adhesive tape, photographs, glass, etc., have outstanding effects. "Ultraviolet luminescence imaging technology" and "ultraviolet laser reflection imaging technology" are the irradiation of potential fingerprints with a wavelength of 266 nm, and through 266 nm and 340 nm bandpass filters respectively, the detection and collection of fingerprints by ultraviolet lasers can be successfully detected, and 70% of them can be successfully detected. The ultraviolet shortwave technology improves the success rate of potential fingerprints, and it is convenient, fast and easy to control its optical properties, which has a broad application prospect in the field of forensic science.
Applications on integrated circuit boards
In the industrial field, the production process of a variety of circuit boards, from the initial wiring to the production of tiny and precise embedded chips that require advanced technology, the flexible circuits in the integrated circuit board, the polymer and copper layer distribution circuits need to drill micro-holes and cut, and also include the repair and inspection of materials on the circuit board, which often requires micro-processing and processing.
Laser micromachining technology is clearly the best choice for circuit board processing. In the process of laser processing, the working machine does not contact with the processed product, effectively avoids mechanical force, processes quickly, has high flexibility, and does not require special requirements for the working occasion, and can reach the order of magnitude below microns through the accurate setting and research and design of laser parameters.
The more traditional drilling method used in circuit boards is to use ultraviolet lasers and CO2 lasers for non-metallic marking (CO2 lasers with a wavelength of 10.6 μm are used for marking non-metallic materials; wavelengths of 1064 nm or 532 nm are typically used for marking metallic materials). At present, ultraviolet laser processing technology is still mainly used, which can achieve micron-level processing, high accuracy, can make ultra-fine parts, and can be applied to microhole processing of laser beams with a spot of less than 1 μm. However, CO2 lasers mainly punch holes of 75~150 mm, and the small holes are easy to be misaligned, while ultraviolet lasers can punch holes below 25 mm with high precision and no misalignment.
Processing of low-light components
In the era of rapid development of science and technology and industry, in order to build more experimental systems and achieve more functions in a smaller space, it is necessary to accelerate the development of information technology, and more importantly, to produce and process more miniaturized, miniaturized and fully functional devices that only deal with the chemical bonds on the surface of the material.
It is possible to cut and optimize at a deeper level on nanoscale microoptics, and to research and develop applications that transform the functionality and properties of traditional optical components. Micro optics have the advantages of easy mass production and easy arraying, as well as being small, lightweight, and flexible, but its main material is quartz glass. Quartz glass is prone to cracks and pits during application and handling, and is a hard and brittle material, which greatly weakens its optical properties.
Therefore, the direct-writing "cold" processing technology of ultraviolet laser greatly improves the efficiency of micro-optical devices, and quickly completes the processing of high-precision micro-structure micro-optical components without damaging the material, and can flexibly complete the processing of different needs of large and small batches.
Applications in the semiconductor industry
The micromachining of semiconductor materials by ultraviolet laser has received more and more attention, thousands of dense circuit components are very common in integrated circuits, so some high-precision processing and processing methods are needed, and there are also some high-precision instruments and devices of semiconductor materials such as silicon and sapphire semiconductor materials and other semiconductor materials precision microprocessing relies on ultraviolet laser and studies the spectral characteristics of thin films, at the same time, ultraviolet laser can also increase the utilization rate of silicon materials for light energy, and can also change the microstructure of silicon surface. It is conducive to the research and development of solar panels, such as two-dimensional micrograting, etc.
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